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To Products Overview :
  • Burn-In Sockets
    • 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package
      • LGA Package
        • Pitch from 0.50mm to 0.79mm
          • Through-hole (THT) soldering Burn-in Socket
            • Burn-in Socket Open Top for 0.50 mm pitch (from 0.50 mm to 0.79 mm)
To Browsing Search :
  • Burn-In Sockets
    • 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package
      • LGA Package
        • Pitch from 0.50mm to 0.79mm
          • Through-hole (THT) soldering Burn-in Socket
            • Burn-in Socket Open Top for 0.50 mm pitch (from 0.50 mm to 0.79 mm)

Burn-in Socket THT Open Top for LGA Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)

 

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.

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Part Number

MPS-xxx-05-xx.x/xx

 

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.