Burn-in Socket Clamshell for 1.00 mm pitch (from 1.00 mm to 1.26 mm)

http://www.e-tec.com/v5/picture_search/burn-in-sockets/burn-in-clamshell-qfn.pngQMC-xxx-10-xx.x/xxBurn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.

To Products Overview :

Burn-In Sockets
- 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package
  - QFN Package
    - Pitch from 1.00mm to 1.26mm
      - Through-hole (THT) soldering Burn-in Socket
        
        Burn-in Socket Clamshell for 1.00 mm pitch (from 1.00 mm to 1.26 mm)
        
        Burn-in Socket Open Top for 1.00 mm pitch (from 1.00 mm to 1.26 mm)

To Browsing Search :

Burn-In Sockets
- 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package
  - QFN Package
    - Pitch from 1.00mm to 1.26mm
      - Through-hole (THT) soldering Burn-in Socket
        
        Burn-in Socket Clamshell for 1.00 mm pitch (from 1.00 mm to 1.26 mm)
        
        Burn-in Socket Open Top for 1.00 mm pitch (from 1.00 mm to 1.26 mm)

Burn-in Socket THT Clamshell for QFN Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)

Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.

View technical datas

Part Number

QMC-xxx-10-xx.x/xx

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.