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Through-hole (THT) soldering Burn-in Socket
Burn-in Socket Clamshell for 1.27 mm pitch (from 1.27 mm to upwards)
E-Tec
QMC-xxx-12-xx.x/xx

Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
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Burn-in Socket Open Top for 1.27 mm pitch (from 1.27 mm to upwards)
E-Tec
QOT-xxx-12-xx.x/xx

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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