Test Sockets & Adapters > Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package > Pitch from 0.30mm to 0.39mm > Probe Pin Solderless Compression Test Socket > Injection Molded Clamshell >
Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.